Outline

Name
Smart Sensing 2021
Dates
5.26(Wed.) -28(Fri.) 2021
Venue
Tokyo Big Sight Aomi Exhibition Hall, JAPAN
Organizer
JTB Communication Design
Co-organizer
Japan Electronics Packaging and Circuits Association (JPCA)
Entry
1,000 yen (free with advance registration)
Co-located Exhibitions
The Total Solution Exhibition for Electronic Equipment
Organizer:   Japan Electronics Packaging and Circuits Association (JPCA)
Japan Institute of Electronics Packaging (JIEP)
Japan Robot Association (JARA)
Japan Federation of Electronic Parts Distributors and Dealers
Tokyo Electronics Appliance Wholesalers Assuciation
Co-Organizer: Electronic Device Industry News (Sangyo Times Inc.)
THE ELECTRIC WIRE & CABLE NEWS(KOGYO TSUSHIN CO.,LTD.)
JTB Communication Design, Inc.
  • 50th International Electronic Circuits Exhibition
  • 35th Advanced Electronics Packaging Exhibition
  • 23nd Jisso Process Technology Exhibition
  • Total Organic Devices Expo
  • WIRE Japan Show
  • JEP / TEP Show
  • E-Textile
interOpto (INTERNATIONAL OPTOELECTRONICS EXHIBITION)
Organizer:   Optoelectronics Industry and
Technology Development Association (OITDA) Presented by:  JTB Communication Design, Inc.
LED JAPAN
Organizer: JTB Communication Design, Inc.
Imaging Japan
Organizer: JTB Communication Design, Inc.
Edge Computing
Co-organizer:  JTB Communication Design, Inc.
Japan Electronics Packaging and Circuits Association (JPCA)

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Organizer

JTB Communication Design, Inc.

Contact

Smart Sensing Secretariat
c/o JTB Communication Design´╝îInc.
Celestine Shiba Mitsui Building, 3-23-1, Shiba, Minato-ku, Tokyo, Japan 105-8335
TEL:+81-3-5657-0771
FAX:+81-3-5657-0645
E-mail:smartsensing@jtbcom.co.jp

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