Outline

Name
Smart Sensing 2019
Dates
6.5(Wed.)-7(Fri.) 2019
Venue
Tokyo Big Sight West Hall, JAPAN
Organizer
JTB Communication Design
Co-organizer
Japan Electronics Packaging and Circuits Association (JPCA)
Entry
1,000 yen (free with advance registration)
Co-located Exhibitions
The Total Solution Exhibition for Electronic Equipment
Organizer:   Japan Electronics Packaging and Circuits Association (JPCA)
Japan Institute of Electronics Packaging (JIEP)
Japan Robot Association (JARA)
Co-Organizer: Electronic Device Industry News (Sangyo Times Inc.)
THE ELECTRIC WIRE & CABLE NEWS(KOGYO TSUSHIN CO.,LTD.)
JTB Communication Design, Inc.
  • 49th International Electronic Circuits Exhibition
  • 33th Advanced Electronics Packaging Exhibition
  • 21th Jisso Process Technology Exhibition
  • Total Organic Devices Expo
  • WIRE Japan Show

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Organizer

JTB Communication Design, Inc.

Contact

Smart Sensing Secretariat
c/o JTB Communication Design´╝îInc.
Celestine Shiba Mitsui Building, 3-23-1, Shiba, Minato-ku, Tokyo, Japan 105-8335
TEL:+81-3-5657-0771
FAX:+81-3-5657-0645
E-mail:smartsensing@jtbcom.co.jp
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